XIO2001: Surface temperature Tc

takanobu fukuoka

Prodigy 70 points

Part Number: XIO2001

Hello,

Please tell me the following four points in the XIO2001 PNP PowerPAD HTQFP Package.

①I want to know the maximum and minimum values of the surface temperature Tc.

I think it can be calculated as follows, but is it correct? [Tc_max = Tj_max - θjc x Pmax = 105 - 18.9 x 0.954 = 87.0]

②What are the conditions that is power consumption and the solder bonding ratio of the Power PAD for the value of ①?

③Does the maximum and minimum value of Tc change depending on the solder bonding ratio of the Power PAD?

④When ③ is YES, please use a graph to tell us what kind of transition.

Best Regards,

T. Fukuoka

over 3 years ago

0 Nasser Mohammadi over 3 years ago

TI__Guru* 93670 points

Greetings,

1). Theta Jc is 18.9 deg C/W. Given maximum power consumption we can back calculate and find Tc max as you have noted. Your equation is correct.

2). I am not aware of solder bonding ratio characterization. I will do further checking and let you know if there is an update.

Regards ,,Nasser

0 takanobu fukuoka over 3 years ago in reply to Nasser Mohammadi

Prodigy 70 points

Hi, Nasser

Thank you for your reply.

Did you confirm item 2)? Please let me know if there are any updates.

Best Regards,

T. Fukuoka

0 Nasser Mohammadi over 3 years ago in reply to takanobu fukuoka

TI__Guru* 93670 points

Greetings,

Apologize for this delay. I thought there was another E2E case and i had responded to this. However, i checked internally and there is no data on solder bonding ratio characterization. Apologize for this inconvenience.

Regards ,, Nasser

Interface

Interface forum

XIO2001: Surface temperature Tc