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SN65HVD1780: SN65HVD1780DR

SHAWN FONG
Intellectual 490 points
Part Number: SN65HVD1780

Hello

Our customer's QC received these recently from Arrow and observed:

1. Different mold encapsulation between 2 samples from the same reel

2. Different mold encapsulation & print format on the bottom of the chip between 2 samples from the same reel (See 2nd link attached)

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/138/DC2111-TOP-N-BOTTOM.png

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/138/DC2110-TOP-N-BOTTOM.png

Are these possible in a manufacturing environment?

And how would it happen in the case of this part#?

Thank you!

  • 0
    TI__Guru 53515 points

    Hi Shawn,

    I'm looking into this with our quality team. Can you share the lot code and any other information included on the shipping label for these devices? If any of this is confidential, you may send me the information via email. Click my E2E name for my contact info.

    And to be clear, the devices shown in the images are from the same reel, correct? (Devices A and B in image 1 come from reel 1. Devices X and Y in image 2 come from reel 2. Is this right?)

    Are the left-mode images of the bottom and top side of the same device? Or are these both top-side images. I understand the right-most image is the top-side. 

    Regards,
    Eric Schott

  • 0 in reply to Eric Schott1
    TI__Guru 53515 points

    Hi Shawn,

    I was able to confirm with our quality team on this. They understood the format of the shared images better than I did, so no need to answer my previous questions.

    Based on the info from the lot trace codes of each device: 

    1. Both samples are using same mold encapsulation materials. 
    2. The print format on bottom of chip can be different, this is expected.

    Let us know if you have any more questions.

    Regards,
    Eric Schott