PCB Stackups for USB 2.0

Mehmet COBAN

Hello,

I am designing a product which has contains 4 USB 2.0 Connectors. It is an only passthrough project but for DM and DP pins I should design this project with high speed rules.

I concern about Layer Stackup because I read TI document which has the title is "High-Speed Differential Signal Routing". As I learnt from this document I should use 6-layer PCB for good EMC but how about layer placement? Is it good to use Signal-ground-ground-ground-ground-Signal layer placement for EMC, Decoupling and Signal Integrity?

Regards,

Mehmet ÇOBAN

over 3 years ago

0 Mehmet COBAN over 3 years ago

Intellectual 275 points

I have to connect 2 usb pins to other 2 usb pins.

0 Mehmet COBAN over 3 years ago

Intellectual 275 points

I'm curious about your thoughts if I want to use 4 layer stackups which placements is Signal-Ground-Ground-Signal or Signal- Ground- Not Used-Signal. Which is better for EMC- Decoupling? Signal-Ground-Ground-Signal or Signal- Ground- Not Used-Signal?

+1 Malik Barton57 over 3 years ago in reply to Mehmet COBAN

TI__Guru 64326 points

For USB 2, a 6 layer board is recommended and best practice but you can get away with 4 layers if the trace is short for this application. Typically full system stack-ups should use 6 layers.

Signal-ground-ground/power-ground/power-ground-Signal or Signal-ground-ground/-Signal would work the best.

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PCB Stackups for USB 2.0