• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 34 subscribers
  • Views 422 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TCAN1042-Q1: Package difference

Lanxi Li
Expert 7005 points
Part Number: TCAN1042-Q1


Hello team,

TCAN1042-Q1 have two kinds of packages, including SOIC and VSON. I have looked over the datasheet and found the ESD and Thermal difference between TCAN1042VDRBRQ1 and TCAN1042VDRQ1. But two questions as below:

  • What is the leadless VSON (8) package (3.0 mm x 3.0 mm) with improved automated optical inspection (AOI) capability ?
  • Could you please help compare TCAN1042VDRBRQ1 and TCAN1042VDRQ1? I an not sure whether there are more difference.
  • Do VSON package have advantages over SOIC?

Best regards,

Lanxi Li

  • 0
    TI__Guru 74322 points

    Lanxi,

    Thanks for bringing this question to E2E. 

    • With typical leadless packages, it is sometimes difficult for the automated optical inspection tool to detect if the solder joint is sufficient for the application. With TI's VSON, the pads on the package are designed so that the solder forms a little bump to make it more visible for these automated inspectors.
    • Beyond the physical size of the IC, there aren't any other differences besides the ones you mentioned.
    • It is dependent on the application. VSON saves space compared to SOIC, and typically have better thermal performance because of the PowerPad. But in an 8-pin CAN transceiver, thermal performance usually isn't a problem.

    Please let us know if you have any other questions.

    Regards,

    Eric Hackett