Dear experts,
Our partner was trying to pre-approve the DP83630SQ ahead of a competitor brand's product.
They brought in parts from TI/Arrow Electronics. Parts were sealed in Original Factory conditions. During IQC, random pieces were taken from the reel. They observed various forms of scratch marks on the under side of several pieces of the chips.
These parts have yet to go onto the prototyping boards. Customer's next step is to conduct a solderability test.
Please advise:
1. if this is a norm observed in the process of manufacturing.
2. if there's anything that our partner should be aware of moving forward.
Attached pictures for your reference and checking.
2. /cfs-file/__key/communityserver-discussions-components-files/138/6049437-_2D00_-SIDE-TOP2.bmp
3. /cfs-file/__key/communityserver-discussions-components-files/138/28.bmp
4. /cfs-file/__key/communityserver-discussions-components-files/138/24.bmp
5. /cfs-file/__key/communityserver-discussions-components-files/138/21.bmp
Thank u in advance.
