TPS25750: condition on assembly, the solder joint area of thermal pad.

Shinya Honda

Part Number: TPS25750

Hello, we are on discussion of assembly for TI's TPS25750 on a PCB.

I have a question, of what the solder joint area of the package thermal pad area does Texas Instruments recommends when the TPS25750 is assembled on a PCB ?

On the application report slma002h, it should be 50%. Is it also applied on the TPS25750?

Regards,

over 3 years ago

0 Tommy Lin over 3 years ago

TI__Mastermind 32280 points

Hi,

Will get back to you as soon as possible.

Regards.

0 Tommy Lin over 3 years ago

TI__Mastermind 32280 points

Hi,

The 50% is "best to have." Simply follow the TPS25750 footprint will ensure the chip works in the optimal thermal range.

Regards.

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TPS25750: condition on assembly, the solder joint area of thermal pad.