DS96F172MQML: Thermal Information

Mark Philip Felipe

Part Number: DS96F172MQML
Other Parts Discussed in Thread: DS96F173MQML, DS90C032QML, DS96F175MQML

Hi Team, seeking for the thermal information for these devices.

5962-9076501M2A - Rjc Bottom:
5962-9076602M2A - Rjc Bottom:
5962-9583401Q2A - Rjc Bottom and Top
5962-9076601M2A - Rjc Bottom and Top

Thank you.

-Mark

over 3 years ago

0 Eric Hackett over 3 years ago

TI__Guru 74252 points

Mark,

These parameters aren't readily available so we'll have to make a request from the thermal simulation team. This usually takes 1-2 weeks, so we will update this thread once the simulation has completed.

Regards,

Eric Hackett

0 Mark Philip Felipe over 3 years ago in reply to Eric Hackett

TI__Genius 10820 points

Hi Eric, Thank you for the information

0 Danny Bacic over 3 years ago in reply to Mark Philip Felipe

TI__Mastermind 26806 points

Hi Mark,

Can you help confirm that the following GPN information is correct for your request?

OPN	GPN	Thermal information
5962-9076501M2A	DS96F172MQML	pending
5962-9076602M2A	DS96F173MQML	pending
5962-9583401Q2A	DS90C032QML	pending
5962-9076601M2A	DS96F175MQML	pending

Thanks,

Danny

0 Mark Philip Felipe over 3 years ago in reply to Danny Bacic

TI__Genius 10820 points

Hi Danny, this is confirmed. Thank you.

0 Danny Bacic over 3 years ago in reply to Mark Philip Felipe

TI__Mastermind 26806 points

Mark,

Thanks for the confirmation here. We've finalized the requests and will get them to you once they finalize in about 2 weeks.

0 Mark Philip Felipe over 3 years ago in reply to Danny Bacic

TI__Genius 10820 points

Hi Danny, Do we have an update for this?

Thank you.

0 Eric Hackett over 3 years ago in reply to Mark Philip Felipe

TI__Guru 74252 points

Mark,

Thanks for following up on this.

Result- Theta JA-High K	43.9
Result-Theta JC, top	20.8
Result-Theta JB	21.1
Result- Psi JT	16.2
Result- Psi JB	20.5
Result-Theta JC, bottom	3.2

All parameters are in units of Cº/W.

Regards,

Eric Hackett

0 Danny Bacic over 3 years ago in reply to Eric Hackett

TI__Mastermind 26806 points

Mark,

Apologies for the delay, as I was out of office for many days and I'm now back!

Also, sorry for any confusion. Eric's answer above is for the DS96F172MQML only. Here are all of the thermal models for the 4 parts you requested:

DS96F172MQML (5962-9076501M2A)

Parameter	Result	Unit
R_θJA	43.9	°C/W
R_θJC(top)	20.8]	°C/W
R_θJB	21.1	°C/W
ψ_JT	16.2	°C/W
ψ_JB	20.5	°C/W
R_θJC(bot)	3.2	°C/W

DS96F173MQML (5962-9076602M2A)

Parameter	Result	Unit
R_θJA	58.2	°C/W
R_θJC(top)	35.5	°C/W
R_θJB	35.3	°C/W
ψ_JT	30.5	°C/W
ψ_JB	34.7	°C/W
R_θJC(bot)	7.6	°C/W

DS90C032QML (5962-9583401Q2A)

Parameter	Result	Unit
R_θJA	62.4	°C/W
R_θJC(top)	39.7	°C/W
R_θJB	39.5	°C/W
ψ_JT	34.7	°C/W
ψ_JB	38.9	°C/W
R_θJC(bot)	9.4	°C/W

DS96F175MQML (5962-9076601M2A)

Parameter	Result	Unit
R_θJA	58.1	°C/W
R_θJC(top)	35.5	°C/W
R_θJB	35.3	°C/W
ψ_JT	30.5	°C/W
ψ_JB	34.7	°C/W
R_θJC(bot)	7.6	°C/W

Modeling assumptions for all results above are that there is no PCB thermal via, no PCB thermal pad connection, and that the package header body is not connected to the PCB.

Best,

Danny

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DS96F172MQML: Thermal Information