TCAN1146-Q1: Thermal expansion coefficients

Antoine Chapuis1

Part Number: TCAN1146-Q1

Dear team,

My customer is interested in knowing the CTEs of the molding compound and leads/ground pad, in order to run a FEA simulation. They are doing this to investigate the cause of soldering joint cracks.

Can you provide this info? I will also dig in to check what are operating conditions causing this soldering defect, let me know of questions of interest there.

Best regards, Antoine

over 2 years ago

0 Eric Schott1 over 2 years ago

TI__Guru 51045 points

Hi Antoine,

Yes, more info on the operating conditions that caused the defect would be interesting. Do you know if the defect occurred after production (possibly right after soldering) or after some time in the field?

The TCAN1146DMTRQ1 uses a Cu base material with a NiPdAu coating, which puts it in the same category of device that's discussed in the thread linked below which includes thermal expansion parameters for these materials. Is this sufficient for the customer's calculations?
https://e2e.ti.com/support/amplifiers-group/amplifiers/f/amplifiers-forum/789140/ina240-coefficient-of-thermal-expansion-cte-for-3-amplifier-parts

Regards,
Eric Schott

0 Antoine Chapuis1 over 2 years ago in reply to Eric Schott1

TI__Expert 5135 points

Hi Eric,

Thanks. I have DIN this design a few months ago, so I am expecting this to be limited to 1st protos, I have asked them for details.

The info you share din this thread is only about the leads/ground plane : customer was also interested in mold compound CTE : do you have it?

Best regards, Antoine

+1 Eric Hackett over 2 years ago in reply to Antoine Chapuis1

TI__Guru 72272 points

Antoine,

Please email us directly for this information.

Regards,

Eric Hackett

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TCAN1146-Q1: Thermal expansion coefficients