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TCAN1463-Q1: Layout not using thermal vias

Part Number: TCAN1463-Q1

Hi,

Customer had a question about designing layout of TCAN1463DMTRQ1.

They have difficulty applying thermal vias due to layout in bottom layer, and considering not using them(: 0.2pi, 6EA in layout pic below). 

Is there any issue with not using thermal vias? I would like to get a confirmed answer. 

Thank you. 

Best Regards,

Zena Lee

 

  • Hi Zena,

    They will be fine without the thermal vias, it is just a very optimal way to connect the thermal plane to the other GND planes on the PCB. However, if they are worried about heat make sure they connect the thermal pad to at least the top layer ground plane. It doesn't even need to be the ground plane specifically it should just be the largest copper pour on the top layer. This is usually the ground plane. This will have the most effect in dissipating heat away from the IC.

    Best,

    Chris

  • Hi Chris, 

    Thanks for the reply. But I'm not sure what you meant by ' It doesn't even need to be the ground plane specifically it should just be the largest copper pour on the top layer. This is usually the ground plane'. Could you explain in more detail? 

  • Zena,

    In order to dissipate heat away from the device we are using the thermal conductivity of the copper in your PCB. The larger the copper layer the better job it will do dissipating that heat. On a PCB the largest layer of copper is usually your ground and power planes. This is just an industry wide standard and there are other benefits to having a Ground plane across the top layer of your board. Either way, whichever layer that your CAN device is connected to, make sure that the thermal pad is connected to the largest copper pour on that layer.

    Best,

    Chris