TCA9544A: withstand maximum gravitational pressure

Kai Lai

Part Number: TCA9544A

Hi Team,

My customer is using our TCA9544APWR, and when they build the PCB board, they will paste the thermal pad on the top of our IC, so they would like to know the withstand maximum gravitational pressure of our IC, do we have such spec can advise to customer ?

Thanks!
Kai

over 2 years ago

0 Tyler Townsend over 2 years ago

TI__Mastermind 47748 points

Hi Kai,

Let me contact one of our packaging engineers to gather more information about this matter. Please allow a couple days of delay before another response. Thanks!

Regards,

Tyler

0 Kai Lai over 2 years ago in reply to Tyler Townsend

TI__Expert 8986 points

Hi Tyler,

Is there any can update now?
https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1138097/tps74801-q1-withstand-maximum-gravitational-pressure

LDO team reply me base on a package team simulation. FYI.

0 Tyler Townsend over 2 years ago in reply to Kai Lai

TI__Mastermind 47748 points

Hi Kai,

Sorry for the delay, but the packaging engineer that I contacted has not responded with any details yet. It looks like the LDO team is able to get a response from the packaging engineers quicker than I can. Let me bump the email that I sent out. I will respond as soon as possible.

Regards,

Tyler

0 Tyler Townsend over 2 years ago in reply to Kai Lai

TI__Mastermind 47748 points

Hi Kai,

I have got into contact with the packaging engineer. Unfortunately, they do not have data on this device for the TSSOP package. They have discontinued this type of test due to the lack of requests.

There might be a way for this test to occur through our failure analysis team, but at this point I cannot guarantee such a test. If I do find that the FA team can conduct the test, it may take weeks before getting data.

Please let me know what the customer would like to pursue.

Regards,

Tyler

0 Tyler Townsend over 2 years ago in reply to Tyler Townsend

TI__Mastermind 47748 points

Hi Kai,

Sorry for the delay. Here is some information I was able to gather from the packaging team.

Results were tested on 32DAD and 56DKQ package (TSSOP packages). Note that there is not industry standard methodology or spec defined to our knowledge.

56DKQ was tested up to 200N and did not see any package failures.

32DAD packages survived up to 500N.

Based on this data, we believe that 200N is a good estimate of max compressive force a package can withstand.

If you desire more accurate data than this, then we would have to setup the engineering test for the 20-pin PW package which could take a couple of weeks.

Regards,

Tyler

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TCA9544A: withstand maximum gravitational pressure