Hi Team,
I understand that “Thermal PAD and GND Pins must be soldered to GND”.
Is Thermal PAD connected to GND of the internal IC circuit?
Therefore, should we connect to GND?
Or is heat dissipation the main purpose?
Regards,
Hide
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Hi Team,
I understand that “Thermal PAD and GND Pins must be soldered to GND”.
Is Thermal PAD connected to GND of the internal IC circuit?
Therefore, should we connect to GND?
Or is heat dissipation the main purpose?
Regards,
Hide
Hi Hide,
This is just for heat dissipation purposes. It is not internally connected to the device.
Best,
Chris