DS16F95QML: Junction to Board Thermal Resistance

Jesse Hernandez

Part Number: DS16F95QML

I am wondering if there is any information on junction to board thermal resistance, or junction to lead thermal resistance? The NAD package datasheet only has a junction to case thermal resistance of 18 C/W. Thank you for your help!

over 3 years ago

0 Danny Bacic over 3 years ago

TI__Mastermind 26836 points

Hi Jesse,

When National Semiconductor first released this part family in 2005 this wasn't yet standard to include. I can request a simulation of this from our packaging team, but these requests can take up to a few weeks to process. Would this work?

Best,

Danny

0 Jesse Hernandez over 3 years ago in reply to Danny Bacic

Prodigy 10 points

Hello Danny,

Thank you for your response. Yes, that still works. I would appreciate an update when that information is available!

0 Danny Bacic over 3 years ago in reply to Jesse Hernandez

TI__Mastermind 26836 points

Jesse,

Ok, sounds good. I'll request to get this started and then once it's finished I'll follow up here. Thanks for your patience.

Best,

Danny

0 Danny Bacic over 3 years ago in reply to Jesse Hernandez

TI__Mastermind 26836 points

Jesse,

This request is still pending, but just confirming: I've asked for DS16F95W/883, since you mentioned the NAD package and this is the only orderable version of this device in the NAD package.

Best,

Danny

0 Jesse Hernandez over 3 years ago in reply to Danny Bacic

Prodigy 10 points

Hello Danny,

Thank you, yes, that part number works.

0 Danny Bacic over 3 years ago in reply to Jesse Hernandez

TI__Mastermind 26836 points

Hi Jesse,

Our thermal simulation is done. Early holiday gift.

Note that these values might vary from the values released from National. At the time of release (1991), these were created using engineering estimates based upon material. Now, we are able to simulate these values more accurately.

Parameter		Value	Unit
R_θJA	Junction-to-ambient thermal resistance	150.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	64.7	°C/W
R_θJB	Junction-to-board thermal resistance	139.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	36.7	°C/W
Ψ_JB	Junction-to-board characterization parameter	124.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.7	°C/W

Best,

Danny

0 Jesse Hernandez over 3 years ago in reply to Danny Bacic

Prodigy 10 points

Thank you very much for the quick turnaround and have a great holiday break!

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DS16F95QML: Junction to Board Thermal Resistance