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AM26LV32E-EP: Additional Testing / Qual for V62 device

Part Number: AM26LV32E-EP


Please tell us what additional testing TI performs on the AM26LV32EMDREP to make it a V62/09602-01XE  as described below?

-> TI takes the AM26LV32EMDREP and performs Testing to prove the part meets the V62/09602

“TABLE I. Electrical performance characteristics. 1/”.

1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the

specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not

necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or

design.

  • Hi Steve,

    Where are you getting that quotation from? Please let me know because I am not seeing that documentation so I want to understand where this is coming from. 

    Both OPNs have the same datasheet specifications - V62/09602-01XE is the Vendor item drawing administrative control number.

    All applicable standards testing documents are listed in the VID on the product page.

    Best,

    Parker Dodson

  • Hi Steve,

    Thanks for the clarification - I am contacting my internal team as I can't find anything definitive on additional testing / quality control measures beyond what we list for the standard OPN - nothing in the document alludes to more testing from what we do with the typical device - as I could say the same statement on any one of our parts (it essentially says we test and characterize the parts in accordance to what's in the datasheet).

    I will let you know within the next 24-48 hours of an update or a timeline if I still don't have a full answer. However based on the information that is shown there is no guarantee of additional quality measures from the included document. 

    Best,

    Parker Dodson

  • Thanks Parker - maybe to simplify things:

    Can you tell us what Texas Instruments does to make a V62/09602-01XE compared to a AM26LV32EMDREP ?

  • Hi Steve,

    I am sorry for the delay - I thought I responded to this thread. I apologize once again. 

    So from a silicon perspective - nothing is different between EP device and the V62 device.

    They have the same testing procedures as the standard EP device - which is temperature testing (min/max), ESD testing (IEC) along with the standard characterization data/ATE results from the device.

    From my understanding they come from 1 fab site only to help minimize differences between fabrication sites.

    The documentation that goes along with the part must be written in accordance with ASME Y14.24 - which sets the minimum standard on the engineering drawings for the VID (the document that you attached) 

    Finally  there are some marking requirements that are also included in the document you attached that are required listed under section 3.

    So ultimately it is the same part that undergoes the same testing - but it seems there is fabrication control and the documentation that goes with the part is written accordance to a specific standard (ASME Y14.24) 

    Best,

    Parker Dodson