The DP83867IRPAPR uses the 64-pin PAP package with a thermal pad.
I understand this device requires the use of thermal vias to achieve reliable operation over the full Ta operating range.
Is that understanding correct?
Is there any guideline on the number/size of the vias?
The datasheet shows one recommendation, but the comments link to other material with 5x5 via matrix.
Regards,
Darren
