The datasheet lists the recommended stencil dimensions as "4.44 x 4.44 x 0.127t"
However, the max standoff of the package is listed as 0.15mm which is greater than the stencil thickness of 0.127mm.
We are concerned there might be a gap between the thermal pad and solder paste that affects solderability / reliability during production.
Could you provide any comment on this?
