TCAN1044AV-Q1: Thermal characteristics CAN IC

Gerald,

The coefficient of thermal expansion for devices is not a standard characteristic that is provided, and obtaining such values usually comes from a complex simulation scheme that would require application-specific characteristics. This is not typically a request at the device level, particularly outside of aerospace application settings. The key general response for your particular question about TCAN1044AVDRQ1 though is that the D (SOIC) package is leaded, and thus the coefficient of thermal expansion is usually negligible due to the characteristics of the leads and the height of the package from the solder point.

There is a prior E2E thread about this topic, found HERE. There is also a good blog post written about this, located HERE.

Let me know your thoughts.

Best,

Danny