SN65LVDT100: SN65LVDT100-There is pin delamination in the bonding wire area

user6350528

Part Number: SN65LVDT100

There is pin delamination in the bonding wire area，Please check whether this situation is normal and whether it affects normal use

over 2 years ago

0 Joshua Salinas over 2 years ago

TI__Mastermind 22070 points

Hello,

Let me transfer you to our High Speed Conditioning team. They will be able to help you with your request.

Regards,

Josh

0 David (ASIC) Liu over 2 years ago in reply to Joshua Salinas

TI__Guru**** 176571 points

Hi,

Is this on the D or the DGK package?

Thanks

David

0 user6350528 over 2 years ago in reply to David (ASIC) Liu

Expert 1530 points

Where to look for this information，

Is it the information in the data table

0 David (ASIC) Liu over 2 years ago in reply to user6350528

TI__Guru**** 176571 points

Hi,

You should able to get the information from the top marking of the device or the device original package. I am trying to determine if the device that shows potential pin delamination is a D or DGK package.

Thanks

David

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SN65LVDT100: SN65LVDT100-There is pin delamination in the bonding wire area