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TCA9416: Package size information

Hardy Xue
Expert 3640 points

Part Number: TCA9416

Hi Team,

Could you please provide below red mark length information and update to datasheet? Thanks.

Best regards,

Hardy

  • 0
    TI__Guru 56458 points

    Hardy,

    I have notified a packaging engineer about this question. Hopefully we can expect results in a week.

    Regards,

    Tyler

  • 0 in reply to Tyler Townsend
    TI__Expert 3640 points

    Hi Tyler,

    Thanks for quickly response.

    We need team's help for this size because customer is in layout stage but they have difficult on footprint building of TCA9416. If we work too long time, it would impact our business. 

    Please let me know the update as soon as possible. Thank you.

    Best regards,

    Hardy

  • 0 in reply to Hardy Xue
    TI__Guru 56458 points

    Hardy,

    Since the packaging engineer is out till 3/7/2023, I thought I would take a different approach to this request by importing the model into Altium Designer, and measuring the clearance between landing pads. Here is what I came up with.

    I was able to measure the clearance between the landing pads at around 4.524 mill = 0.1149096 mm

    I also have included the link here where the customer can download this same footprint from TI.com ultra librarian. 

    Please let me know if this helps.

    Regards,

    Tyler

  • 0 in reply to Tyler Townsend
    TI__Expert 3640 points

    Hi Tyler,

    The clearance between landing pads is too small. Based on my customer's feedback, if the clearance between landing pads <0.18mm, PCB factory cannot add solder mask between pad and pad. It will cause short easily.

    Also, according to solder past example in datasheet, I don't think the clearance between landing pads only have 0.11mm. Could you check it again? Thank you.

    Best regards,

    Hardy

  • 0 in reply to Hardy Xue
    TI__Guru 56458 points

    Hi Hardy,

    I will double check the clearance measurements and notify the packaging team again. 

    Regards,

    Tyler

  • 0 in reply to Tyler Townsend
    TI__Guru 56458 points

    Hi Hardy,

    This request to get it more exact is going to take longer than expected. I would need to setup some time in lab with the packaging engineering team to be able to take such a measurement. It seems that it might take a couple of weeks to get this done. 

    Regards,

    Tyler

  • 0 in reply to Hardy Xue
    TI__Guru 56458 points

    Hi Hardy,

    Sorry for the delay in responding. 

    After some further digging, I think we have a misunderstanding of what each of these drawings mean in the datasheet. 

    While the customer is looking for an exact measurement in the above picture on the land pattern, we have to keep in mind that this is an example drawing. The dimensions shown in the land pattern example are merely a estimate on what the dimensions "should" look like. These do not have to be exact, but must be similar to the actual metal on the IC in order for there to be a solid solder joint from the PCB to the IC. 

    Note that the land pattern on the left has a typical pad shape that does not capture every small detail to that of the metal on the actual IC. You can especially see this difference on PIN 1 ID, where there is a specific notch cut out of the metal. The land pattern for pin one just needs to be big enough to ensure a solid solder joint between the two. The dimensions of the land pattern can have some wiggle room. 

    Please let me know if this helps. 

    Regards,

    Tyler