Hi Team,
We received PCN letter.
Then, Thermal Information of SN65HVD32DR is changed.
Could you please let us know why Thermal Information was changed?
<Rev L(Old)>
<Rev M(New)>
Regards,
Hide
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi Team,
We received PCN letter.
Then, Thermal Information of SN65HVD32DR is changed.
Could you please let us know why Thermal Information was changed?
<Rev L(Old)>
<Rev M(New)>
Regards,
Hide
Sometimes, thermal information changes because TI did better measurements or improved the computations.
But this is not the case here. The PCN tells you that there is a new fab that also uses a new die. So the device itself has changed. Old chips are described by the old thermal information, new chips are described by the new thermal information.