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SN65DPHY440SS: Application issue.

Expert 1910 points
Part Number: SN65DPHY440SS

Hi Team,

1. The SN65DPHY440SS cannot fully interpret the input data from the source after running for a period of time.

As a result, the processor (Qualcomm) reports an ecc error and fails to collect data.

2. Swap test ,problem follow chip.

Please help me, 

Thanks!

  • Hi,

    Can you share your schematic and layout? Can you probe both the input and the output of DPHY440?

    The DPHY440 has a thermal pad, can you verify that you have sufficient solder coverage to its thermal pad?

    Thanks

    David

  • I can verify that have sufficient solder coverage to its thermal pad,because it soldered smoothly.Could you share your e-mail address, I can send you the sch and layout for detail. The chip's losing efficacy goes with temperature, before it loses efficacy, it works as a good one.But when in sick, Qualcomm will shut down the eng because of the ECC error.yellow is DA green is DB

  • Hi,

    Would you please accept my friendship request so you can send me the schematic and layout in a private e2e message? 

    Is the issue only happening with temperature? At what temperature are you seeing the failure and does the failure go away when you bring the temperature back to 25C?

    Thanks

    David

    1. At an ambient temperature of 30°C , the Qualcomm platform continuously obtains dual camera images. After running for a period of time(tens of thousands of frames), the platform reported ECC error stop. Restart process, get a few frames of image and failed again.
    2. At an ambient temperature of 10°C, do the same thing as the first item above. The dual camera can run stably, and the test time is about 3 hours.
    3. At an ambient temperature of 50°C, do the same thing as the first item above. The process fails immediately and can not be repaired even retry.But when the temperature goes down to 10°C,it can be repaired again.
  • Hi,

    Is it possible to get a x-ray picture of the DPHY440 thermal pad? Given that the issue is related to the temperature, I would look at the thermal pad itself. 

    Can you also send me the schematic and layout in a private message? I like to check and make sure there is no issue with the design itself.

    Thanks

    David

  • Could you send me a message by private  ? I do not find the right way to send you the sch and layout.

    And could you give us some suggest about the layout impedance.? our platform prefer Differential 70~100Ω,single-ended 36~52Ω. And SN65DPHY440SS prefer 100-Ω differential impedance (± 15%) and 50-Ω single-ended impedance (± 15%). Which is the best choise consider of the manufacturing variation.  (85Ω?90Ω ? or any else ?)

    You speak Chinese ?My tel:(+86  13693635821)  如果可以的话,希望有一次电话交流。

  • Hi,

    I confirmed the thermal solder coverage is meeting the requirement. 

    I sent you a private message, can you check and see if you received it?

    Thanks

    David