This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi Experts,
Can you confirm the differences of the two parts below?
I do understand that the AM26LV31EIDR is the closest option for the old part DS26LV31TM.
Also, I do see that the AM26LV31EIDR is IEC certified and nothing showing that the DS26LV31TM offers this feature/certification.
Would you be able to confirm as to whether this is accurate?
Regards,
Archie A.
Hi Archie,
Please see full comparison table below: (please note it says /NOPB on the end of the DS device - but its the same specifications - this isn't the first request on this change - so I had a pre-made table, from a comparison viewpoint its the same however)
|
Parameter |
DS26LV31TM/NOPB min |
AM26LV31EIDR min |
DS26LV31TM/NOPB typical |
AM26LV31EIDR typical |
DS26LV31TM/NOPB max |
AM26LV31EIDR max |
Comments |
|
Top Level Part Information |
|
|
|
|
|
|
|
|
Configuration |
- |
- |
4TX 0RX |
4TX 0RX |
- |
- |
|
|
Package |
- |
- |
D (SOIC) |
D (SOIC) |
- |
- |
|
|
Pin to Pin |
- |
- |
Y |
Y |
- |
- |
|
|
Standard Supported |
- |
- |
TIA/EIA-422-B & ITU Recommendation V.11 |
TIA/EIA-422-B & ITU Recommendation V.11 |
- |
- |
|
|
ESD SPECIFICATIONS |
|
|
|
|
|
|
|
|
HBM (Bus Facing Driver Pins) |
- |
- |
+/-7kV |
+/-15kV |
- |
- |
|
|
HBM (Other Pins) |
- |
- |
+/-2.5kV |
+/-2kV |
- |
- |
|
|
CDM |
- |
- |
Not Specified |
+/-1kV |
- |
- |
|
|
IEC 61000-4-2 Contact Discharge (Bus Facing Driver Pins) |
- |
- |
Not Specified |
+/-8kV |
- |
- |
|
|
IEC 61000-4-2 Air Gap Discharge (Bus Facing Driver Pins) |
- |
- |
Not Specified |
+/-15kV |
- |
- |
|
|
TEMP/THERMAL SPECIFICATIONS |
|
|
|
|
|
|
|
|
TA (Ambient Temperature Range) |
-40C |
-40C |
- |
- |
85C |
85C |
|
|
Tj (Junction/Virtual Junction Temperature) |
Not Specified |
Not Specified |
- |
- |
Not Specified |
150C |
|
|
Tstg (storage Temperature) |
-65C |
-65C |
- |
- |
150C |
150C |
|
|
RθJA (Junction to Ambient Thermal Resistance) |
- |
- |
73.6 C/W |
73.0 C/W |
- |
- |
|
|
RθJC(top) (Junction to Case (top) Thermal Resistance) |
- |
- |
31.1 C/W |
32.8 C/W |
- |
- |
|
|
RθJB (Junction to Board Thermal Resistance) |
- |
- |
32.5 C/W |
31.0 C/W |
- |
- |
|
|
ΨJT (Junction to Top Characterization Parameter) |
- |
- |
3.7 C/W |
5.1 C/W |
- |
- |
|
|
ΨJB (Junction to Board Characterization Parameter) |
- |
- |
30.8 C/W |
30.7 C/W |
- |
- |
|
|
ABS MAX RATINGS (Electrical) |
|
|
|
|
|
|
|
|
VCC |
-0.5V |
-0.5V |
- |
- |
7V |
6V |
|
|
VI (Driver/Enables) |
-0.5V |
-0.5V |
- |
- |
VCC + 0.5V |
6V |
|
|
Input Clamp Current |
-20mA |
-20mA |
- |
- |
20mA |
N/A (no diode to VCC on driver inputs) |
|
|
Driver Output Voltage |
Not Specified |
-0.5V |
- |
- |
Not Specified |
6V |
|
|
Driver Output Clamp Current |
Not Specified |
-20mA |
- |
- |
Not Specified |
N/A |
|
|
Continuous Output Current |
-150mA |
-150mA |
- |
- |
150mA |
150mA |
|
|
Continuous Output Current VCC to GND |
Not Specified |
-200mA |
- |
- |
Not Specified |
200mA |
|
|
RECOMMENDED OPERATION |
|
|
|
|
|
|
|
|
VCC |
3V |
3V |
3.3V |
3.3V |
3.6V |
3.6V |
|
|
VIn |
0V |
0V |
- |
- |
VCC |
5.5V |
|
|
Input Rise and Fall Time |
Not Specified |
Not Specified |
- |
- |
500ns |
Not Specified |
|
|
ELECTRICAL SPECIFICATIONS |
|
|
|
|
|
|
|
|
VOD1 (No Load) |
Not Specified |
2V |
3.3V |
Not Specified |
4V |
4V |
|
|
VOD2 (RL = 100Ω) |
2V |
2V |
2.6V |
2.6V |
Not Specified |
Not Specified |
|
|
ΔVOD (RL = 100Ω) |
-400mV |
-400mV |
7mV |
Not Specified |
400mV |
400mV |
|
|
VOD3 (RL = 3900Ω) |
Not Specified |
Not Specified |
3.2V |
Not Specified |
3.6V |
Not Specified |
|
|
VOC (RL = 100Ω) |
Not Specified |
Not Specified |
1.5V |
1.5V |
2V |
2V |
|
|
ΔVOC (RL = 100Ω) |
-400mV |
-400mV |
6mV |
Not Specified |
400mV |
400mV |
|
|
IOZ (Device high impedance leakage current) |
-20uA |
-100uA |
+/- 500nA |
Not Specified |
20uA |
100uA |
Test setups are different |
|
IOFF (Device powered off leakage current) |
-100uA |
-100uA |
-80nA/30nA |
Not Specified |
100uA |
100uA |
Different Test Setups – Split into a few separate specs on DS device sheet – similar performance expected |
|
ISC (short circuit current) |
-150mA |
-150mA |
-70mA |
Not Specified |
-40mA |
-30mA |
|
|
VIH |
2V |
2V |
- |
- |
VCC |
5.5V |
|
|
VIL |
0V |
0V |
- |
- |
0.8V |
0.8V |
|
|
IIH |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
10uA |
Not Specified |
|
|
IIL |
-10uA |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
|
|
IIN |
Not Specified |
-10uA |
Not Specified |
Not Specified |
Not Specified |
10uA |
Eq. To IIH and IIL on DS device – different naming convention – similar performance expected |
|
VOH |
Not Specified |
2.4V |
Not Specified |
3V |
Not Specified |
Not Specified |
|
|
VOL |
Not Specified |
Not Specified |
Not Specified |
0.2V |
Not Specified |
0.4V |
|
|
VCL (V Clamp) (with 18mA current) |
-1.5V |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
|
|
ICC (no Load) |
Not Specified |
Not Specified |
Not Specified |
Not Specified |
100uA |
100uA |
|
|
Cpd (power dissipation capacitance) |
Not Specified |
Not Specified |
Not Specified |
160pF |
Not Specified |
Not Specified |
|
|
TIMING SPECIFICATIONS |
|
|
|
|
|
|
RL = 100Ω and CL = 50pF for DS device test |
|
Tphl/Tphld (high to low propagation delay) |
6ns |
4ns |
10.5ns |
8ns |
16ns |
12ns |
|
|
Tplh/Tplhd (low to high propagation delay) |
6ns |
4ns |
11ns |
8ns |
16ns |
12ns |
|
|
Tskd (differential Skew – same channel) |
Not Specified |
Not Specified |
500ps |
500ps |
2ns |
1.5ns |
|
|
Tsk1 (pin to pin skew) |
Not Specified |
Not Specified |
1ns |
Not Specified |
2ns |
1.5ns |
|
|
Tsk2 (part to part skew) |
Not Specified |
Not Specified |
3ns |
Not Specified |
5ns |
3ns |
|
|
TTLH (differential transition time low to high) |
Not Specified |
Not Specified |
4.2ns |
5ns |
10ns |
10ns |
|
|
TTHL (differential transition time high to low) |
Not Specified |
Not Specified |
4.7ns |
5ns |
10ns |
10ns |
|
|
TPHZ (High Output to Disable) |
Not Specified |
Not Specified |
12ns |
10ns |
20ns |
20ns |
|
|
TPLZ (Low Output to Disable) |
Not Specified |
Not Specified |
9ns |
10ns |
20ns |
20ns |
|
|
TPZH (Enable to High Output) |
Not Specified |
Not Specified |
22ns |
10ns |
32ns |
20ns |
|
|
TPZL (Enable to Low Output) |
Not Specified |
Not Specified |
32ns |
10ns |
32ns |
20ns |
|
|
Fmax |
32MHz |
Not Specified |
Not Specified |
32MHz |
Not Specified |
Not Specified |
|
Most of the specifications are marginally different - and yes you are correct the AM device is IEC rated where the DS device is not.
The differences are mainly marginal or beneficial to switch from DS devices to AM device - so it shouldn't negatively impact the system in most applications, but it is a good idea for the designers to review possible changes to gauge whether or not there could a edge case type issue.
Please let me know if you have any other questions!
Best,
Parker Dodson
