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SN65176B: SN65176BP having two different xray image

Poh Kok Keng
Genius 5512 points
Part Number: SN65176B

Dear Support,

Xray shows these 2 units having the same body marking, the internal die (1 is smaller than the other) and leadframe are different

Back unit Lot code: 21AHNZM

Good unit LOT code: 22A1H3M 

I understand they are 2 PCNs (20210811000 and 20211229001) within in relation to DS update. 

But is it normal for xray images to be so different? 

Customer is facing 100% failure at ICT. Impedance measurement shows differences in characteristic:

Impedance measurement (In Ohm)

 

GOOD IC

BAD IC1

BAD IC2

BAD IC3

Pin1 to GND(Pin5)

1.14 Mega ohm

0.6 Mega ohm

0.62 Mega ohm

0.6 Mega ohm

Pin2 to GND(Pin5)

Open

Open

Open

Open

Pin3 to GND(Pin5)

Open

Open

Open

Open

Pin4 to GND(Pin5)

Open

Open

Open

Open

Pin6 to GND(Pin5)

0.5 Mega ohm

292 Kilo ohm

291 Kilo ohm

293 Kilo ohm

Pin7 to GND(Pin5)

1.04 Mega ohm

Open

Open

Open

Pin8 to GND(Pin5)

432 Kilo ohm

Open

Open

Open

Please advice, if the difference  Xray images is normal? and why the Impedance characteristic is so different for pin1 and pin 6? 

For the 2 PCN changes, which revision histroy actually involved? yellow circle or Red circle portion below? 

Best regards,felix

  • 0
    TI__Guru 52462 points

    Hi Felix,

    1. Both parts lot codes show up in our systems so I don't have any real reason to believe these are illegitimate devices.

    2. The die physically changed - so the X-Ray will also change; the new device is designed to - as best as possible - mimic the function and parameters of the old die so they are drop in replacements still. 

    3. We don't characterize the impedances you measured - so we don't guarantee anything with respect to those measurements. That being said - we have noticed that the die updates we have done recently on other devices do have a change in these impedances but it hasn't caused an issue in operation for other customers - so while I can't exactly tell you what those impedances should be (as we don't have this specification characterized) - they will be different from one variant of the device to the next. The dies are physically different so the impedances can change. 

    4. Both updates happened (its two datasheet updates for 1 device changed\) - I updated the datasheet - and there was a missed update value but the system already merged our updates so I had to open another revision. The Last two changes were supposed to be on  1 update of the datasheet - but due to a missed value we had to update it again resulting in the two changes seen in datasheet. 

    Please let me know if there are any functional issues seen - but right now it seems like its just differences between the different dies. 

    Best,

    Parker Dodson.

  • 0 in reply to Poh Kok Keng
    Genius 5512 points

    Dear Parker Dodson,

    Can I have the  qualification report for new die?

    I have filed the CPR No. CPR231082222 for this case but customer is asking for below:

    1. Evaluation report or evidence that shows the changes leading to the PCNs (20210811000 and 20211229001)
    2. Evidence of the bonding diagram for the IC at Mexico plant

    Best regards,

    Felix

  • 0 in reply to Poh Kok Keng
    TI__Guru 52462 points

    Hi Felix,

    I can't provide that information on a public forum  - please reach out to your field rep for more information to see if this information is possible - but generally speaking you probably will get any of this information. 

    Best,

    Parker Dodson