DS110DF410: DS110DF410 : Junction-to-board thermal resistance

Sujith Mohandas

Part Number: DS110DF410

Hi Team,

Could you please share the RθJB Junction-to-board thermal resistance value of DS110DF410SQ?
My power consumption is around 1.53 W ,What will be the IC junction temperature when I increase the ambient temperature to 71 degree c.
I have checked the datasheet of DS110DF410SQ, but couldn't find the RθJB Junction-to-board thermal resistance value.Please see the below images

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Regards,
Sujith m

over 2 years ago

+1 Evan Mayhew over 2 years ago

TI__Mastermind 24998 points

Hi Sujith,

Please refer to this thread for DS110DF410 thermal information:

https://e2e.ti.com/support/interface-group/interface/f/interface-forum/639659/ds125df410-need-thermal-data

The following appnote has details on estimating junction temperature using this information:

https://www.ti.com/lit/an/spra953c/spra953c.pdf

Assuming a constant RθJA = 26.1°C/W, the junction temperature for T(A) = 71°C and P = 1.53W using Equation 2 is T(J) = 111°C.

Thank you,

Evan

0 Sujith Mohandas over 2 years ago in reply to Evan Mayhew

Prodigy 190 points

Hi Evan,

Thanks for your inputs.
Then if we are testing board without heat sink upto 71°C, I hope it will work without any issue.
Could you please check whether heat sink is mandatory for DS110DF410 QFN IC if we are assembling board inside enclosure?

Regards,
Sujith M

0 Evan Mayhew over 2 years ago in reply to Sujith Mohandas

TI__Mastermind 24998 points

Hi Sujith,

I expect it to work without issue at T(A) = 71°C without a heat sink.

Do you expect the ambient temperature to increase while it is in the enclosure? If the upper limit is T(A) = 71°C while it is in the enclosure, then a heatsink is not needed.

Thank you,
Evan

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DS110DF410: DS110DF410 : Junction-to-board thermal resistance