Junction-to-case thermal resistance data (Rjc) for various parts

Hi Kiran,

We will have to submit thermal requests for these devices. The turn around time will be around 2 weeks.

I will respond back on this when we have the thermal information back. 

Hi Kiran,

I will assign this to MUX for now while I wait for the thermals to come back for SN74LVC138AQDREP and SN74LV393ATPWREP.

For now, I have SN74LVC2G74MDCUTEP thermals below. 

SN74LVC2G74MDCUTEP Thermals:

Hi Kiran,

See below for info on CD74HC4067SM96. Kicking over to HVP-FET now. 

Thanks!

Alex

Hello Kiran,

Thanks again for your interest in TI FETs. The CSD18541F5T is a chip scale device. Essentially, a silicon chip with solderable, metallized LGA pads. There is no lead frame, bond wires or plastic overmolding. Therefore, we do not spec Rθjc in datasheet since case and junction are very nearly the same temperature. There should be very little difference in temperature measured on the surface of the device and the junction temperature. Please let me know if you have any additional questions. FYI, the CSD18541F5T and CSD18541F5 are the same device with the only difference being reel size and quantity per reel. The CSD18541F5T is in a small reel with 250 pieces per reel and the CSD18541F5 is in a large reel with 3000 pieces per reel.

Thanks,

John

Thanks for your responses. I am still waiting for thermal data for

SN74LVC138AQDREP,
SN74LV393ATPWREP and
LMK1D1204RGTT

Appreciate your response as soon as possible.

Thanks for your responses. I am still waiting for thermal data for

SN74LVC138AQDREP,
SN74LV393ATPWREP and
LMK1D1204RGTT

Appreciate your response as soon as possible.

Hi Kiran,

Regarding: SN74LVC138AQDREP, SN74LV393ATPWREP

I just checked and it has not been updated yet, but in work. 2 weeks is on this Thurday, 7/20, so I will check back then. Generally the thermal information comes back exactly on time.

Thanks

Only one more left now (LMK1D1204RGTT). Will someone be looking into this?

Regards

Kiran