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SN55HVD233-SP: 5962L1420901VXC lid ground/float

Yohei Kusachi
Prodigy 150 points
Part Number: SN55HVD233-SP


To Whom It May Concern,

Is 5962L1420901VXC, Package 8-lead CFP [HKX] 6.48 mm × 6.48 mm, 8-pins lid grounded or floating?

I did find on data  sheet page 32 package HKU note 6 mentioning Metal lid is connected to back side pad metalization.

I believe package design are the same but there's no statement regarding metal lid connection on HKX package.

It'll be great if you could kindly advise if 8-lead CFP [HKX] lid is grounded or not.

Thank you for your attention and support.

Kind Regards,

Yohei Kusachi

Fuji Electronics America, Inc.

  • 0
    TI__Guru 53928 points

    Hi Yohei,

    I believe for the 5962L1420901VXC device that the CFP package metal lid is separate from any internal connection to the device deeming it an electrically floating metal lid. 

    The metal lid in the HKU diagram is connected to the back side pad metallization (thermal pad). The thermal pad is used for heat dissipation and is not connected to any pin of the device, but we recommend that thermal pad be connected to GND net in layout. Here is a link that also describes where to connect the thermal pad connection if thermal pad is present.

    https://e2e.ti.com/support/logic-group/logic/f/logic-forum/723481/faq-where-do-i-connect-the-thermal-pad-of-the-logic-qfn-devices

    Regards,

    Tyler

  • 0 in reply to Tyler Townsend
    Prodigy 150 points

    Hi Tyler,

    Hope you're well and thank you so much for your kind reply in detail.

    I think this part#5962L1420901VXC has only CFP HKX 8-pin and no CFP HKU 10-pin package.

    And the data sheet shows nothing regarding metal lid connecting back side pad metalization for HKX package (HKU 10-pin has the note 6 " Metal lid is connected to back side pad metalization."

    So, according to the data sheet and information kindly provided, I also believe this part# 5962L1420901VXC CFP HKX 8-pin metal lid is separated from any internal connection.

    Please allow me to get the information kindly provided back to our team and it'll be great if you could kindly provide us your knowledge if further support is needed.

    Thank you again for your kind support and warm consideration.

    Kind Regards,

    Yohei Kusachi

  • 0 in reply to Yohei Kusachi
    TI__Guru 53928 points

    Hi Yohei,

    Yohei Kusachi said:
    I think this part#5962L1420901VXC has only CFP HKX 8-pin and no CFP HKU 10-pin package.

    You are correct in this statement. 

    Yohei Kusachi said:
    And the data sheet shows nothing regarding metal lid connecting back side pad metalization for HKX package (HKU 10-pin has the note 6 " Metal lid is connected to back side pad metalization."

    Yes, when I was explaining I was referring to the HKU package. 

    Yohei Kusachi said:
    So, according to the data sheet and information kindly provided, I also believe this part# 5962L1420901VXC CFP HKX 8-pin metal lid is separated from any internal connection.

    This is also true. You can view the metal lid as a no connect. The metal is floating, and not internally connected inside the HKX package. 

    Regards,

    Tyler