Hi Expert,
Do we know the substrate for the pin size(without ball)?

My customer can't do the via on pad(GND pin) on type 3 PCB, so they plan to reduce the footprint size for layout routing(0.23 to 0.22). Is there any side effect for reduce the ball?

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Hi Expert,
Do we know the substrate for the pin size(without ball)?

My customer can't do the via on pad(GND pin) on type 3 PCB, so they plan to reduce the footprint size for layout routing(0.23 to 0.22). Is there any side effect for reduce the ball?

Hello,
This difference should not make a huge difference 0.01 deviation from recommended value should be ok.
Thanks,
Chris

Believe this will help from the datasheet: https://www.ti.com/lit/gpn/tpd2s300
Hi Chris,
My customer try to change the land pattern from 0.23 to 0.2, because the GND trace is too weak, they want to reduce the land pattern to 0.2 to increase the GND trace. Do we have any concern for this design? thank you.

Cheers,
Far
0.3 diameter ball needs a MINIMUM of 0.2 so customer can do this but will be cutting it very close. Helpful chart from IPC spec:
