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TLK2711-SP: TLK2711 IBIS Package Model

Part Number: TLK2711-SP

Hello,

Hyperlynx simulations using the TLK2711 IBIS model show ~100mV greater amplitude when probed at the die as compared to the pin. It appears this is due to inductive kick from the package inductance. For spec compliance, do you recommend probing at the pin or at the die?

Thank you