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TLK2711-SP: pcb footprint

Tyler J
Prodigy 30 points
Part Number: TLK2711-SP

Hi there

Can you clarify the thermal pad constraints? The datasheet calls out for a thermal pad at 4.19mm^2 at the center but the layout design suggests outerwise (circular pad with thermal vias around it)

Ive attached a footprint in Altium and I need suggestions if this needs improvement.

drive.google.com/.../view

Thanks

  • 0
    TI__Mastermind 35883 points

    Hi Tyler,

    I think the layout screenshot in the datasheet is a bit unclear.  I think the circle in the layout may be a physical feature on L1, similar to via or large circular pad, but looking at the EVM layout, L1 does have a square pad.  In other words, I believe all "red" in the datasheet layout recommendation is copper on L1.  I would recommend following EVM implementation.  I can send you a private message with a PDF of EVM layout.

    Thanks,

    Drew