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DP83867IS: RGZ package - thermal pad and pin footprint

Part Number: DP83867IS

Hello team,

I have two questions regarding the footprint of DP83867ISRGZ. 

1) The datasheet is showing two different thermal pad sizes for one and the same package. How is it possible to check, which thermal pad is used by "DP83867ISRGZ"? Is the RGZ0048A or RGZ0048B?

2) Customer is using the device since years in one of their applications (test equipment for automotive) and they are building boards from time to time. Now they have recognized a possible footprint change. It seems like the footprint of each pin is different now. This is also visible in their layout, when they overlay old and new design. Has there been an update in the pinout recently? Did the pad size decrease?

Customer is having issues with non-functional devices due to possible bad solder joints, since the pins are not any longer completely on the solder pad.

Looking forward on your feedback and support to solve the confusion.

Thanks and best regards,

Michael