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TCA9548A-Q1: Land pattern design question for Via size of thermal pad

user6013811
Prodigy 170 points
Part Number: TCA9548A-Q1

Hi

According to the design of the "Land pattern example" in the datasheet, it has 5 via of 0.2Φ and 1.1mm distance.

What's the purpose of this design?

Could we use the bigger size of via and more than 5 numbers on the thermal pad for heat dissipation?

Thank you so much.

Frank

  • 0
    TI__Intellectual 1166 points

    Hi Frank,

    Yes this is TI's recommendation footprint for this device, but you have the freedom to choose whatever layout makes the most sense. I will say though the TCA9548A-Q1 specifically does not burn much power so more vias or larger vias will likely not impact the performance much, unless your ambient temperatures are very extreme. 

    It would essentially impact your RθJA which is calculated based on the JDEC standard layout. If you have a more optimized thermal layout, your RθJA will decrease. 

    Thanks,

    Stephen