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DP83867E: Interpretation of part marking (manufacturing date) and description of any die changes

Part Number: DP83867E

We are having trouble with a new build of circuit cards using the DP83867E.  Our old build boards from 2018 work fine and the PHYs establish link without issue.  However, our new builds from this year fail to establish link.  Both boards are using the same software for configuration (so configuration settings are the same).  The PHYs are set to autonegotiation.

Review of the current datasheet shows an update to the part (datasheet revision C to D) in the August 2022 timeframe.  The update states:  Added following wording to the end of first paragraph in Section 8.4.3.9 "DP83867 devices manufactured after August, 2022, have an increased random seed value that now includes 255 different seed values to expedite Auto-MDIX resolution with a link partner."

Does this mean that there was a die change to DP83867E that is identified in the rev D of the datasheet?  And if so, how can we determine if we are using the new part?  Is there any additional information on the changes than what is identified in the datasheet (i.e., is there any errata or application note information on the changes)?  

Here are the part markings from the old/working PHY and the new/non-working PHY:

Working PHY:  DP83867E    TI   96I    ATTS  G4

Nonworking PHY:  DP83867E    TI   7CI    AH26  G4

Thanks in advance for your assistance.