SN65HVD11: Difference between SN75HVD11DG4 and SN65HVD11DR

The suffixes R (= reel) and G4 (see [FAQ] Why does a logic device's part number have an E4/G4 suffix?) have no practical effect.

However, you're likely to be affected by PCN 20220324002.1, which changed the die and the fab.

user5163865 said:

1) Are the wafers the same?

I'm not sure I can directly comment on this since these devices have different GPNs. Generally, the SN75 nomenclature is related to device temperature supporting of 0C to 70C while SN65 usually supports a wider range like -40C to 85C or up to 125C. The devices also share the same datasheet.... 

user5163865 said:

2) Are the production factories the same?

From my internal search, it appears like the fab and assembly sites are different.

user5163865 said:

3) Are there any differences in test content (other than temperature)?

From what I can see, it looks like the ATE is the same. It was based/built on the SN65 device

Clemens Ladisch said:

However, you're likely to be affected by PCN 20220324002.1, which changed the die and the fab.

Clemen's is correct here, the FAB and Assembly site for the SN65HVD11 device was moved in the PCN that was issued. 

-Bobby

Clemens-san, Bobby-san,

Thanks a lot.

Best regards,

Hiroshi