Hello,
Why is the package drawing for X2SON (DPW) only the 3D of the part and does not include the land pattern details like in the datasheet (see attached below)?
We need a separate document for the land pattern of this part if possible.
Thank you.
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hello,
Why is the package drawing for X2SON (DPW) only the 3D of the part and does not include the land pattern details like in the datasheet (see attached below)?
We need a separate document for the land pattern of this part if possible.
Thank you.
Hi Jhon,
I am a little confused by your question here, so I would like to clarify some things here.
Here is the TPD4E101 datasheet: https://www.ti.com/lit/ds/symlink/tpd4e101.pdf?ts=1710162139536&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FTPD4E101
On page 16, the 3D view is shown. On page 17, the package outline is shown. On page 18, a land pattern example is shown. On page 19, a solder paste example is shown.
Do pages 17/18 satisfy what you need, or is there something additional to these pages that would be required?
Best Regards,
Josh Prushing
Yes, these are the pages we are looking for, but just wondering if there is a separate document for this? The link to the package drawing for X2SON (DPW) only shows the 3D package itself. Other packages have the package dimensions as well as the recommended landing pattern.
Hi Jhon,
Thank you for the clarification here, I understand your question now!
I am currently reaching out to our packaging team in order to update this, and I will keep you posted on any updates. This may take a few days to reflect on the product page, is there a specific date you need this document by?
Best Regards,
Josh Prushing
Hi John,
The packaging team said that this process is completely automated, and that there would be some investigations into resolving this. It supposedly is going to be a very lengthy process.
In the meantime, I have created a document for you that should have all of the packaging information you need, please see the attached: TPD4E101_Package.pdf
Would this be sufficient for your needs?
Best Regards,
Josh Prushing
Hi Josh,
Apologies for the late response, I was out of office for the past day.
Yes, this document is sufficient for our needs. Thank you for the support on this.
Regards,
Jhon Gonzales
Hi Lovely,
As mentioned above, TI's process for generating these documents is automated, which can lead to some situations like the one covered in this thread and the situation you are seeing with the INT-LOGIC device. We are unable to resolve this ourselves, as there is a different team that covers this tool, but I have reached out to try and gain some resolution to this. For the document I provided in this thread, I manually created this as a short term resolution. Would you be interested in me doing the same for the device in the other thread?
Best Regards,
Josh Prushing