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DS320PR810: footprint recommendation related to GND

Part Number: DS320PR810

I have a query on the footprint recommendation for the DS320PR810.

In the below picture(Figure 1) of the recommended footprint, the GND via distribution in the center of the package is not uniform as it does not have GND via in the areas encircled in RED color.

Any specific reason why the GND via is not provided in those areas.

Can we not have a GND via distribution as in Figure 2 below. Please clarify.

Figure 1:

Figure 2:

  • Hi Brian,

    Based on the packaging group analyzes and recommended solder paste mask, this has been used on TI EVMs and other customers. It is possible that what you've done could work as well however recommended land pattern is the recommended option.

    Regards, Nasser