AM26C32: AM26C32MFKB / 5962-9164001Q2A

Hi Sidd,

So I don't believe we give a statement directly on Water Soluble Flux/Aqueous Cleaning - but our general handling/process recommendations are all going to be found in this app note: https://www.ti.com/lit/an/snoa550h/snoa550h.pdf?ts=1604933360676&ref_url=https%253A%252F%252Fwww.ti.com%252Fsupport-packaging%252Fpackaging-resources%252FSMT-and-application-notes.html&_ticdt=MTcxNDc0NTQ1NnwwMThhMjdlNDgxZmUwMDFkM2JjY2UzNmY1MTAxMDUwNmYwMDFhMDY3MDA3ZTh8R0ExLjEuMTI1MTAyODI2MS4xNjkyODg2NDEzfG51bGx8bnVsbHxHUzEuMS4xNzE0NzQ1MTk5LjIyNC4xLjE3MTQ3NDU0NTYuMC4wLjB8bnVsbHxHUzEuMS4xNzE0NDk1NDU0LjkzLjEuMTcxNDQ5NTQ2NS4wLjAuMHxudWxs

To quote the flux selection portion of the document:

"""

The key function of flux is to dissolve the oxides on the metal surface to facilitate the wetting of the molten solder. The most commonly used flux is Rosin based with low flux residue activity (ROL0 and ROL1 per IPC-J-STD-004). Certain active and aggressive fluxes are easy to use but may cause corrosion and contamination if not cleaned properly. TI recommends using ROL0 or ROL1 type flux with a minimum level of corrosive elements, mild activity level and a pH value close to 7. Fluxes containing chloride should be avoided.

"""

That does seem to be the information we have available and I don't see any other documents pointing any other way - and we have no specific documentation for this part beyond the app note which largely applies to all of our devices. 

Best,

Parker Dodson