This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TCA6408A: thermal pad

Part Number: TCA6408A

Tool/software:

Hi team, 

due to reduced space on the board, the components of our design have to be shrinked. Instead of TCA6408A in TSSOP now the VQFN package is used. However, I cannot find a comment in the datasheet, to which potential the thermal pad on the bottom of he package has to be connected. I would assume it has to be GND - could you please confirm? 

Thanks, 
Jens