Tool/software:
Hi team,
due to reduced space on the board, the components of our design have to be shrinked. Instead of TCA6408A in TSSOP now the VQFN package is used. However, I cannot find a comment in the datasheet, to which potential the thermal pad on the bottom of he package has to be connected. I would assume it has to be GND - could you please confirm?
Thanks,
Jens