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TCA6408A: thermal pad

Jens Tyslik
Intellectual 1610 points
Part Number: TCA6408A

Tool/software:

Hi team, 

due to reduced space on the board, the components of our design have to be shrinked. Instead of TCA6408A in TSSOP now the VQFN package is used. However, I cannot find a comment in the datasheet, to which potential the thermal pad on the bottom of he package has to be connected. I would assume it has to be GND - could you please confirm? 

Thanks, 
Jens