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Digital Isolator ISO7221ADR - soldering specification

Tze Khong Yap
Prodigy 245 points

Dear All,

 

For TI Digital Isolator ISO7221ADR, need your help to advise the soldering information as below.

 

a) Understand it is SOIC/8 package, what is recommend soldering method? Reflow IR-Ray or Reflow Hot Air?

b) What is hand soldering Maximum temperature?

 

Thank you.

  • 0
    TI__Genius 11765 points

    Hello,

     For soldering:
     Convection reflow (hot air) is the preferred PCB reflow process, but either convection or IR can be used.. The device is characterized with & is compatible with PbFree soldering conditions & profile in JEDEC JESD22-B102E (Solderability for either IR or Convection, PbFree reflow with peak temperature of 230 to 245 degrees. 
     
       A primary concern during soldering is internal package delamination from atmospheric moisture absorption & soldering temperature. This stress testing is done in an IR or convection oven (J-STD-020 test conditions are used).  This testing shows that the component can be heated to a peak body temperature of 260 Degrees without adverse reliability problems. 
     
       For hand soldering, the plastic body should be kept below the 260 Degree limit evaluated for the J-STD-020 test. This is not usually a problem since the heat is applied only to the external leads, and the duration is short. An example is that a solder tip temperature may need to be set at 343 Degrees C  for PbFree Vs 315 for SnPb. The time of heat application should be kept to the minimum needed to form an acceptable joint.