Tool/software:
Hello team,
My customer need substance information for TCA6418EYFPR.
I have searched "Quality, reliability, packaging data download", but it only shows Copper, Tin, and Silver for Solder Bump. (There was no mold compound)
https://www.ti.com/quality-reliability-packaging-download/report?opn=TCA6418EYFPR
Is the package for TCA6418EYFPR (DSBGA), not covered by mold compound like WLCSP?
Best Regards,
Kei Kuwahara
