DS160PR810: [DELL/FXCN]2 pcs of 810 top-bottom overlapping placement

Robin Liu

Intellectual 1930 points

Part Number: DS160PR810

Tool/software:

hi team,

customer want to check because the board size constraint, if can make 2pcs redriver thermal pad to be completely overlapping on top layer and bottom layer?

and then reduce the number of thermpad via to avoid soldering issue, because looks the via is optional?

regards,

Robin Liu

over 1 year ago

0 Nasser Mohammadi over 1 year ago

TI__Guru* 93670 points

Hi Robin,

This is very risky. Placing these on top of one another and reducing thermal via may cause manufacturing issues later on.

From signal integrity point of view i believe this should be fine since traces would be on the same side as the redriver.

Regards, Nasser

0 Robin Liu over 1 year ago in reply to Nasser Mohammadi

TI__Intellectual 1930 points

hi Nasser,

ok for Manufactory issue i;ll let customer to judge by themselves.

and do you think thermal heat should be fine for this method?

regards,

Robin Liu

0 Nasser Mohammadi over 1 year ago in reply to Robin Liu

TI__Guru* 93670 points

Hi Robin,

This depends on the board stack up. I think if they use 8 layers or higher with at least 1oz copper this could be ok.

Regards, Nasser

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DS160PR810: [DELL/FXCN]2 pcs of 810 top-bottom overlapping placement