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DS250DF810: Question about DS250DF810

Part Number: DS250DF810

Tool/software:

Hello:

The application of customer DS250DF810 chip is as follows: the speed needs to be configured to 10.3125 Gbps through EEPROM; Currently, according to SNLA244 instructions, several versions of bin files have been configured but none of them have implemented the functionality;

Can you provide a bin file template for configuring the speed to 10.3125 Gbps through EEPROM? Is there a more detailed bin file configuration document?

  • Hi Jimmy,

    What is the I2C address of the DS250DF810 in this application?

    Does the DS250DF810 need to support both 10.3125 Gbps and 25.78125 Gbps using the same EEPROM file?

    Thanks,

    Drew

  • Hi Drew:

    The I2C address of DS250DF810 is 0x30, the EEPROM chip capacity is greater than 256 bytes, model: AT24C08D-SSHM-T

    Please provide three versions, with EEPROM files supporting 10.3125 Gbps and one version available; Supports 25.78125 Gbps and provides a version; Simultaneously supporting 10.3125 Gbps and 25.78125 Gbps, a new version will be provided;

    Thanks!!!

  • Hi Jimmy,

    Please note that the customer can generate EEPROM using our SigCon Architect GUI.  During their validation, it's possible they may need to try different EEPROM configurations.

    Please note these EEPROMs use adapt mode 1, and have default TX settings.

    https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/ds250df810_5F00_10G.hex

    https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/ds250df810_5F00_25G.hex

    https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/ds250df810_5F00_10G_5F00_25G.hex

    Thanks,

    Drew