Tool/software:
Hello,
In the datasheet https://www.ti.com/lit/ds/symlink/tca6408a.pdf of TCA6408ARGTR there is mention of thermal pad (pin17 on the RGT0016A model) but there is no mention of that thermal pad should be connected to ground.
Should I connect it to ground in my design?
The datasheet implies that 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. but I could not find any reference to connect it to ground or not?
Best Regards,
C
