Tool/software:
<PCN#> 20210112004.2
<Device> DS90UR904QSQX/J7003069
Would you please fill the blunk?
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Bonding Wire |
材料 |
Au |
Cu |
|
Wire Diameter[mils] |
1.0 |
0.8 |
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Tensile Modulus[GPa] |
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Tensile strength[gms] |
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Thermal Conductivity[W/m・k] |
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Electrical resistivity[uΩ・cm] |
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hardness[GPa] |
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