Tool/software:
Hi team - I know it is possible to make the SOIC and SOT-23-THN package layouts compatible. Is it also possible to make a footprint compatible with the VSON and SOT-23-THN?
Thanks,
Jacob
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Tool/software:
Hi team - I know it is possible to make the SOIC and SOT-23-THN package layouts compatible. Is it also possible to make a footprint compatible with the VSON and SOT-23-THN?
Thanks,
Jacob
Jacob,
The VSON package and SOT package are actually the same size, and the pins should line up right on top of each other. So, it should work, but we don't have any material showing this. I'm basing this off the mechanical drawings in the datasheet as well.
Regards,
Eric Hackett
Eric, the footprint of the DDF collides with the thermal GND pad of the VSON footprint. Could you take a closer look at the footprints and let me know if there is a recommended footprint that will work for both packages?
Jon,
You are correct, my mistake. Unless the customer is willing to violate the landing pad recommendation in our datasheet by making the SOT leg footprints shorter, there isn't an option here. But, if they are willing to shorten those footprints, that would leave room for the VSON thermal pad, and the leads would still all line up. The SOT package would be taking on some risk since the overall solder surface area would be ~half of the recommendation.
Regards,
Eric Hackett