Tool/software:
Dear TI experts,
My customer found failure issue while production.
If the thermal pad of IC don't connect to GND of PCB, the IC heats up when it operates, finally shutdown.
And if they use cryo spray to the top of IC, it operates normally for a few seconds and shutdown again.
Is it normal behavior?
(heating up symptom when thermal pad not connect to GND properly and fshutdown)
Do you have any data about failure function because of the heating up?
(e.g. MUX in the IC do not operate when heating up)
Please check this issue. Thanks.
Best regards,
Chase
