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TPD2EUSB30A: Not good solder filled on my SMT process

Jose Miguel Vargas
Prodigy 10 points
Part Number: TPD2EUSB30A

Tool/software:

I am working to improve the filled for component TPD2EUSB30ADRTR it is a SOT -3, I sent some samples to analyze to an external laboratory and the result was:

"There are no solderability issues per se with these parts. However, what you are dealing with is very heavy burrs from trimming the parts and inconsistent lead length and some very heavy tool marks."

I am reworking this part on all my products are using, with solder iron, flux and more solder trying to have a better solder joint but is very complex due to the tiny form.

Any advice you can give me will be very appreciated.

  • 0
    TI__Mastermind 18340 points

    Hi Jose,

    If you have a hot air gun and solder paste, that is my preferred method of soldering small components like ESD diodes by hand.

    If you only have a solder iron, use a very fine tip and lots of flux. 

    I would recommend applying a small amount of solder to the pads. 

    Then place the device on top of the footprint with tweezers and reflow the solder on the pads of each side to make the connection. 

    Regards,

    Sebastian