Tool/software:
The thermal resistance ( junction-to-case (θJC)) provided for the package "GDFP2-F16" in "SN55LVDS31 SMD 5962-97621" is about 22 °C/W, what does the junction-to-case (θJC) refereed, is it from junction to top or from junction to bottom, if its for junction to bottom case, in that case what will be the recommended thermal conductive material ,recommended copper pad on the PCB, recommender soldering method to ensure contact between IC, PCB and thermal material also kindly provide Junction to board thermal resistance, Similarly required details for the below mentioned parts also