Tool/software:
I understand that the PCA9306IDCURQ1 is manufactured at multiple wafer FAB and assembly/test FAB sites. Upon reviewing the reliability test results of the ICs manufactured at each FAB site, it appears that the ESD test results differ for each FAB site. Does this mean that the ESD resistance of the ICs manufactured at each FAB site is different? Or are the test conditions different, and the ESD resistance of the ICs manufactured at each FAB site is equivalent?
P.S.: I contacted your customer support center with inquiry No. CS2610656 and was instructed to inquire on the E2E support forums, so I have done so.
