TS3DV642: TS3DV642A0RUAR thermal vias

Hidemasa Sawada

Part Number: TS3DV642

Tool/software:

Hello,
Could you please guide me on how many thermal vias I need for this part?
I am considering using 10 0.2mm diameter vias in the areas without metal mask openings to avoid solder flow in.

10 months ago

0 David (ASIC) Liu 10 months ago

TI__Guru**** 180071 points

Hi,

For thermal via design, please see below stencil example.

Thanks

David

0 Hidemasa Sawada 10 months ago

Prodigy 50 points

Hello David,
Sorry, did not mention that we would like to reduce the number of VIAs if possible. In fact, does this component need approximately this number of vias for this component?
I would appreciate any comments or suggestions you may have.

0 David (ASIC) Liu 10 months ago in reply to Hidemasa Sawada

TI__Guru**** 180071 points

Hi,

The TS3DV642 thermal pad via also serves as ground via for the ground return path. So the number of vias represented in TI example land patterns located near the end of the data sheets should be considered as an example starting point. The stencil aperture with consideration of 3 major factors:

Balancing the solder coverage,
Thermal conductivity,
Passage for outgassing to minimize solder voids.

So if you are going to reduce the number of via, please consider the impact on these 3 major factors. You can also reference to this app note, https://www.ti.com/lit/an/slua271c/slua271c.pdf, for more information.

Thanks

David

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TS3DV642: TS3DV642A0RUAR thermal vias