PCA9306: Bad soldering ability

Kasper Larsen

Part Number: PCA9306

Tool/software:

Hi,

I am having problems with the soldering of one of your components. The PCA9306 is difficult to get a good connection, and often I will need to manual resolder the connection to ensure that the connection is good. I have noticed that the solder is not flowing up the package pin and changing the pin color from cobber to silver.

I have followed the instructions of the datasheet regarding the layout footprint. The SMT machine is not using a nitrogen inert atmosphere. Instead, they are using some sort of solder paste which does not require it. I am not an expert here so I am hoping you can help me.

Your component is not the only one that we are having problems with. We also are having problems with ECMF2-40A100N6 from ST which also have a similar size footprint/pins.

Do you have any recommendations regarding the soldering to improve the quality? Or advice on solder paste and the atmosphere?

BR. Kasper

7 months ago

0 Clemens Ladisch 7 months ago

Guru 316510 points

SON/QFN packages have the actual contacts at the bottom; the absence of a solder fillet does not necessarily indicate a bad solder connection.

Certain automotive device have packages with wettable flanks; see Novel Plating Technology for Wettable-Flank QFN and SON Packages. For 'normal' SON/QFN packages, optical inspection is not possible.

0 Tyler Townsend 7 months ago

TI__Mastermind 47128 points

Hi Kasper,

I don't have much personal experience with soldering this type of package so my knowledge is limited.

TI has written a couple of application notes / tech articles similar to this. Please let me know if this application note would help.

Mounting of Surface Mount Components (Rev. B)

Regards,

Tyler

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PCA9306: Bad soldering ability