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THVD2452V: Requisition for Junction to Case (bottom) thermal resistance and Max Case temperature of THVD2452VDR

Shibijith C
Prodigy 210 points
Part Number: THVD2452V

Tool/software:

Hi Ti Team,

Greetings!

We like to know the Junction to Case (bottom) thermal resistance and Case Temp (°C) Max of THVD2452VDR.

  • 0
    TI__Genius 13542 points

    Hi Shibijith,

    Thanks for reaching out!

    I just submitted a request to get that Junction to case (bottom) value from our thermal team so please allow up to 2 weeks for this information. I will keep you updated on this E2E thread.

    As for the case temp, could you clarify what you mean by this? For reference, this device has 125C max for ambient temp, and 150C max for junction temperature. 

    Best,

    Ethan

  • 0 in reply to Ethan Sempsrott
    TI__Genius 13542 points

    Hi Shibijith,

    I requested the bottom thermal resistance, and the thermal team got back to me. The junction-to case (bottom) is only applicable for packages with exposed pads, which this SOIC package does not have. So that is why there is no value for it in the datasheet.

    Aside from that, the best thermal values should be specific to your system and layout so I would recommend testing for your system specifically. 

    Best regards,

    Ethan